3D IC Integration and Packaging
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A comprehensive guide to 3D IC integration and packaging methods, solutions, and real-world applications
Autor: | John, Klaus |
Nakladatel: | McGraw-Hill Education - Europe |
ISBN: | 9780071848060 |
Rok vydání: | 2015 |
Jazyk : | Angličtina |
Vazba: | Hardback |
Počet stran: | 480 |
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